| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayered wiring board which can be made compact greatly by forming first and second circuit elements in a first conductor layer on one surface side or the other surface side which are different from each other. SOLUTION: This multilayered wiring board 10 is provided with a multilayered ceramic wiring board which is formed by laminating and fixing a plurality of cermic wiring boards 12A-12C where conductor layers 11A-11D as a first conductor layer are formed on one surface or both surfaces and conductor layers 11E and 11F which are formed as a second conductor layer having an optional pattern on one surface and the sides of the other surfaces 20A and 20B of the multilayered ceramic wiring board with insulation layers 13A and 13B respectively interposed. Thus, matching of the processes for forming first and second circuit elements can be made easy, and the first and second circuit elements be formed adjacent to each other on one surface or the other surface which are different to each other. Therefore, such a multilayered wiring board that can be made compact greatly can be realized.</p> |
