| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to obtain planarity and heat conductivity on the chuck surface of an electrostatic chuck device, and to make it possible to prevent dielectric breakdown. SOLUTION: An electrode 18 is formed on a metal substrate 12 between an elastic bonding agent layer 14 and an insulating chuck layer 22 through an elastic bonding agent layer 14, a current application means, provided with a current application means 27 and a connection means 26 used to electrically connect to an electrode 28 penetrating the elastic bonding agent layer 14, is provided. A through hole 25b, which is used to guide the current application means to the outside, is formed on the metal substrate 12, and a high resistance bonding agent layer 14a, having electric resistance higher than the elastic bonding agent layer 14, is provided between the elastic bonding agent layer 14 and the current application means in this electrostatic chuck device.</p> |
