| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need of installing, especially, a seal structure and to enhance the assembling property in a sensor device in which an IC module is housed and fixed inside a housing. SOLUTION: An inside assembly 23 provided with a support 22 which is made of a synthetic resin, a terminal block 17 and a terminal block 18 both ends of which protrude from the support 22, which are buried in the support 22 and which are made of a conductive metal, and an IC module 16 which is connected to one side of the terminal blocks 17, 18 and which is attached to the support 22, is insert-bonded into a housing 15 which is molded with mold so as to cover the inside assembly 23 and which is made of a synthetic resin. A coupler part 15c in which the other side of the terminal blocks 17, 18 appear, is molded integrally with the housing 15.
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