摘要 |
PROBLEM TO BE SOLVED: To obtain a negative type photosensitive composition which ensures a high developing speed and gives a polyimide resin having a low coefficient of thermal linear expansion by incorporating a linear polyimide resin precursor consisting of specified structural units and a sensitizer. SOLUTION: The photosensitive composition contains a linear polyimide resin precursor consisting of structural units of formula I and structural units of formula II and a sensitizer. The linear polyimide resin precursor is a polyamic acid. The sensitizer is preferably a dihydropyridine derivative of formula III wherein X1-X4 are each H, fluoroalkyl or the like, Y1 is cyano or -COR3, Y2 is cyano or -COR4, R3 and R4 are each 1-4C alkyl, alkoxy or the like and R1, R2 and R4 are each H or 1-3C alkyl. |