发明名称 NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING SAME
摘要 PROBLEM TO BE SOLVED: To obtain a negative type photosensitive composition which ensures a high developing speed and gives a polyimide resin having a low coefficient of thermal linear expansion by incorporating a linear polyimide resin precursor consisting of specified structural units and a sensitizer. SOLUTION: The photosensitive composition contains a linear polyimide resin precursor consisting of structural units of formula I and structural units of formula II and a sensitizer. The linear polyimide resin precursor is a polyamic acid. The sensitizer is preferably a dihydropyridine derivative of formula III wherein X1-X4 are each H, fluoroalkyl or the like, Y1 is cyano or -COR3, Y2 is cyano or -COR4, R3 and R4 are each 1-4C alkyl, alkoxy or the like and R1, R2 and R4 are each H or 1-3C alkyl.
申请公布号 JP2000098609(A) 申请公布日期 2000.04.07
申请号 JP19980273909 申请日期 1998.09.28
申请人 NITTO DENKO CORP 发明人 FUNADA YASUTO;OMOTE TOSHIHIKO
分类号 G03F7/004;C08K5/3432;C08L79/08;G03F7/038 主分类号 G03F7/004
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