| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a semiconductor substrate from sliding out, hitting the floor and being broken if a pickup hole of a semiconductor substrate carrier is directed to the floor by a mistake by inserting/taking out the semiconductor substrate in the semiconductor substrate carrier only when the semiconductor substrate carrier is mounted on a manufacturing apparatus. SOLUTION: When a semiconductor substrate carrier 1 is set in a semiconductor manufacturing apparatus, part of a stopper 3 out of the bottom is pushed up and a valley of the stopper 3 comes to a valley between guides 7. Only when the semiconductor substrate carrier 1 is set in the semiconductor manufacturing apparatus, a semiconductor substrate 11 held in the semiconductor substrate carrier 1 can be taken in/out. If a pickup hole of the semiconductor substrate carrier 1 is directed to the floor by a mistake during handling of the semiconductor substrate carrier 1, the semiconductor substrate 11 is slid out to hit the stopper 3 and stop, thereby preventing it from getting out to hit the floor and being broken.</p> |
