| 摘要 |
PROBLEM TO BE SOLVED: To improve a semiconductor element mounting pad in adhesion with respect to sealing resin by a method, wherein a recess is provided to an island where a semiconductor chip is mounted, and a fissure is provided to the recess so as to extend from the rear to the front of the island. SOLUTION: When a circular recess 2 is formed on a semiconductor element mounting pad 1, a through-hole 5 smaller than the circular recess 2 is provided first, the through-hole 5 is pressed by a round punch 7 from the rear 1a of an island 1 or the semiconductor element mounting pad 1, whereby a recess 2 which is half as deep as the thickness of the pad 1 is formed. With this setup, a part 6 around the through-hole 5 is crushed to nearly close the through-hole 5, and a fissure 3 is formed as a blocking line to close the through-hole 5. Therefore, a semiconductor element mounting pad is enhanced in adhesion with respect to sealing resin, and a brazing material such as Ag paste or the like that fixes the semiconductor element hardly leaks out to the rear surface.
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