| 摘要 |
PROBLEM TO BE SOLVED: To prevent the planarity of an inner lead from being dispersed and to prevent the occurrence of resin flare on an exposed face at molding by clamping a part of the exposed inner lead and molding it. SOLUTION: An exposure face 6 of an inner lead 7 is depressed to a lower die 12 with a first upper die 11, and an inner lead exposure part 10 containing the inner end 13 of the inner lead exposure part 10 is clamped. A first molding process for sealing a pad 2, a semiconductor chip 1, a wire 4, the inner lead 7 containing a bend part 14 except for the exposure part and an inner lead tip 3 and the pad 2 except for the exposure face with resin, is executed. Then an outer lead is clamped by a second upper die and a lower die 12, and the inner lead exposure part 10 is sealed with resin. In first molding, the inner lead is fixed, and the inner lead exposure part 10 is molded in a subsequent second molding process. Thus, the occurrence of resin flare on the exposure face 11 of the inner lead 7 is prevented. |
