| 摘要 |
PROBLEM TO BE SOLVED: To enable high-density wiring and to reduce the manufacturing cost. SOLUTION: A multilayer printed wiring board 1 comprises 6 layers with circuits 22, 7, 3, 4, 8 and 23. The circuit 22 of the first layer and the circuit 7 of the second layer are connected through a non-through connecting hole 17. The circuit 22 of the first layer and a circuit 3 of the third layer 3 are connected through a non-through connecting hole 18. The circuit 23 of the 6th layer and a circuit 8 of the 5th layer are connected through a non-through hole 19. The circuit 23 of the 6th layer and the circuit 4 of the 4th layer are connected through a non-through hole 20. The circuit 7 of the second layer and the circuit 3 of the third layer and the circuit 8 of the 5th layer and the circuit 4 of the 4th layer are not connected in interlayer. Copper foils 5a and 5b with insulating resin are formed through etching on the circuit 7 of the second layer and the circuit 8 of the 5th layer. |
