| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for a rotating mechanism at a wafer treatment device side and enable a square wafer to be loaded on a wafer stage in a desired direction. SOLUTION: A wafer P, carried in by an arm 102, is received by a carrying arm 46 setting a rotation angle of the arm 46 at the side of an aligner 10 at a rotation angle, according to a direction of a square wafer P during carrying-in by the carrying-in arm 102 at the side of a wafer treatment device 100. Therefore, whichever direction the arm 102 at the side of the device 100 carries in the wafer P, delivery of the wafer P is made possible with an arm 54 rotated at an angle according to a direction thereof. The received wafer P is loaded by the arm 46 on a wafer stage PST in a specified direction, that is, the direction which is convenient to an aligner. Therefore, the rotating mechanism at a wafer treatment device side becomes unnecessary, and a square wafer can be loaded on a wafer stage in a desired direction. |
