| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for applying efficient bonding and sealing to a wafer, in the case where the manufacture and processing of a water are executed by forming a single device, and arranging the constitution so that the space within vacuum may arise in the device, using the microprocessing technique. SOLUTION: In this method, eutectic is made for sealing between bonding material and sealing material and a wafer by raising the temperature and performing the annealing, after laying upper and lower two wafers equipped with bonding material and sealing material on top of the other for engagement within a vacuumized processor. As a result vacuum condition is created and is kept within the device. |
