| 摘要 |
PROBLEM TO BE SOLVED: To enable solder bumps to be placed easily on the electrodes of a work without using an expensive equipment by a method, wherein a mask of paper or resin is pasted on the work with adhesive agent, the electrodes of the work are irradiated with a laser beam from above the mask to bore holes in the mask, and solder is inserted into the holes. SOLUTION: A mask 1 is pasted on the surface of a work 3 with an adhesive agent 2. Electrodes 4 are irradiated with a laser beam from above the mask 1, and holes 4 are bored in the mask 1 and the adhesive agent 2 on the electrodes 4 penetrating through them. Solder are inserted into the holes 7. The work 3 with the mask 1, where the solder are inserted into the holes 7, is heated by a heating device to melt the solder. Thereafter, when the molten solder balls are bonded metallically to the electrodes 4 of the work 3, the molten solder are cooled down below a solder fusing temperature so as to be solidified into solder bumps 9. Furthermore, the mask 1 is pulled to be removed from the work 3. With this setup, solder can be mounted easily on the electrodes of a work without using expensive equipment. |
