| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer member for transferring wiring layers which enables manufacture of a multilayer wiring board provided with multiple wiring layers transferred to a base board in sequence which can comply with fine and high-density wiring, does not require complicated manufacturing steps, exhibits high productivity, is suitable for mass production and high to quality. SOLUTION: A transfer member is used for forming a conductive layer as wiring part on a material which is an object of transfer through an adhesive insulating layer as an adhesive layer. In this case, the member is provided with at least a conductive substrate 110 in plate form which can be plated and exhibits a peeling property; a polyimide resin layer 120 which is stacked on one side of the conductive substrate 110, and is provided with a first opening part 125 in a specified form corresponding to the form of a wiring part to be formed; a conductive layer 140 as wiring part which is formed by plating on one side of the conductive substrate 110 in such a way that the first opening of the polyimide resin layer 120 is filled; and a metal layer 130 which is stacked on the polyimide resin layer 120, includes a wiring area and an area for forming an adhesive insulating layer serving as an adhesive layer at the time of transfer of the wiring part, and is provided with a second opening 135 which is larger than these areas. |
