| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor from easily being scratched during assembly and to prevent wires from being deformed by forming recessed parts in a heat sink and die-bonding the semiconductors into the recessed parts. SOLUTION: In an assembly, semiconductors 7 are die-bonding into the recessed parts 12 of heat sinks 11 with high melting point solders 8. The heat sinks 11 are mounted on conduction foil 3 formed on a metallic substrate 1 and are soldered by solders 5. The conduction foil 10 of the metal substrate 1 is connected with the semiconductor 7 with aluminum wires 6. Then, lead terminals 4 are soldered to the conduction foil 10 of the metal substrate 1 by solders 5. Even if the faces of the semiconductors 7 are dropped downward due to careless handling, shock is absorbed by outer peripheral walls A forming the recessed part 12 of the heat sink 11, and the surfaces of the semiconductors 7 will not be damaged. Thus, a hybrid integrated circuit can be constituted without scratching the semiconductors due to careless handling during assembly.
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