发明名称 METHOD FOR TREATING ELECTROMAGNETIC WAVE SHIELD MATERIAL IN FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain an electromagnetic shield which can improve the electromagnetic wave shielding characteristic and mechanical strength of a flexible printed wiring board used for electronic equipment, such as a note personal computer, etc. SOLUTION: A method for treating electromagnetic wave shield material for a flexible printed wiring board consists of a process for laminating a metallic fibrous sheet 2 obtained by sintering metallic fibers into a sheet upon the surface of a flexible printed wiring board 1, a process for punching the laminated body in a prescribed shape, and a process for covering the metallic fibers 4 with a resin 4 by coating the surface, peripheral edge, and cut face of the sheet 2 in the punched laminated body with the resin 4. Therefore, the occurrence of such an electric trouble as short-circuiting, etc., caused by separated or raised metallic fibers can be prevented even when the wiring board 1 is bent many times in a step of incorporating the wiring board 1 in electronic equipment, or the like.
申请公布号 JP2000101289(A) 申请公布日期 2000.04.07
申请号 JP19980282094 申请日期 1998.09.18
申请人 TOMOEGAWA PAPER CO LTD 发明人 SUZUKI TAKANORI;KOMIYAMA GENICHIRO;TSUCHIDA MINORU;KITAHARA HIROSHI
分类号 H05K3/28;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K3/28
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