发明名称 HIGH-FREQUENCY CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To realize a high-frequency circuit board where high-frequency signals are prevented from deteriorating as they are transmitted, wherein the high-frequency signal circuit board is composed of a dielectric board and transmission lines formed on its front and rear surface and connected together through a through-hole. SOLUTION: A pair of transmission lines composed of coplanar lines 21, 22, 21' and 22' with ground are provided to the front and rear of a dielectric board 1, and the coplanar lines are electrically connected through through-holes 41 and 42. The coplanar lines are each surrounded with ground electrodes 30 and 30', a distance between the coplanar lines and the ground electrodes is set wider near the through-holes. By this setup, high-frequency signals can be lessened in transmission loss caused by through-holes, so that a high-frequency circuit board of this constitution is capable of transmitting high-frequency signals restraining them from deteriorating even if a mounted module MMIC is a high-frequency circuit module.
申请公布号 JP2000100993(A) 申请公布日期 2000.04.07
申请号 JP19980269930 申请日期 1998.09.24
申请人 发明人
分类号 H05K1/02;H01L23/12;H01P3/08;H01P5/02 主分类号 H05K1/02
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