CIRCUIT BOARD PRODUCING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board producing method for reducing/avoiding disconnecting defects at the time of plating inside the through-hole of an insulat ed board. SOLUTION: Concerning a circuit board producing method with which a plated base layer 2 is formed on the surface of an insulated board 1 by sputtering, the section to become a non-circuit part 3 is irradiated with electromagnetic waves, and a circuit part 4 is formed by applying plating to the residual plating base layer 2, the insulated board 1 has a through-hole 5 and the thickness of a conductive film (a) formed on the inner surface of the through- hole 5 is increased by inverse sputtering or means for blocking etching at the time of plating is provided inside this through-hole 5.