| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical coupling in a microregion between substrates by separating a mechanism junction part from an electrical coupling part for joint, for a thinner substrate. SOLUTION: A structure comprising electrical coupling regions 6 and 7 and joint regions 10 and 11 comprising mechanical joint parts 17 and 19 between substrates 1 and 2 is formed on both substrates. After the substrate 2 is rotated in plate while the joint regions 10 and 11 on both substrates are so aligned as to face each other with the coupling regions 6 and 7 also aligned to face each other, the most substrates are applied with a pressurizing force 21 to joint the joint parts 17 and 19 together so that the coupling regions 6 and 7 are electrically coupled together in solid-phase joint. After the solid-phase joint, the substrate 2 is polished to a thin one, to provide an electrical joint in a microregion where an interface dislocation is brought about to the surface of the thin substrate. |
