| 摘要 |
PROBLEM TO BE SOLVED: To judge whether a packaging of an element is conformed or not without breaking the element by making internal electrodes have electrical continuity with second conductive resin layers via a first conductive resin layer and covering the parts excluding the parts having continuity with the outside via a first conductive resin layer on the rear of a substrate and the first conduc tive resin layer on the surface of the substrate and each one part of the side surfaces of the substrate with a resin. SOLUTION: An InSb thin film sensitive to a magnetism and internal electrodes 2 are provided on a silicon substrate 1 and these electrodes 2 are formed by an electroless Cu plating at the four corners of an individual semiconductor device. Such the electrodes 2 are made to have electrical continuity with second conductive resin layers 6, which are external electrodes, via a first conductive resin layer 4. A thermosetting epoxy resin 5a is applied on the rear of the substrate 1 by a spin coater and a thermosetting epoxy resin 5b is applied on the side of the surface of the substrate 1 by the spin coater in a thickness enough to cover the semiconductor device, the electrodes 2 and the layer 4 to cure the resins 5a and 5b.
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