| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency package excellent in high-frequency characteristics by a method wherein it is protected against characteristic impedance mismatching and deterioration in transmission characteristics. SOLUTION: A signal line 1 is composed of a micro strip line structure that comprises a package inner part and a package outer part, a strip line structure that is a hermetically sealed part, and an embedded microstrip line structure that is a tapered part which connects them together. Therefore, the tapered part can be prevented from causing characteristic impedance mismatching. Furthermore, the embedded microstrip line structure can be comparatively easily formed, so that a high-frequency package of this constitution can be lessened in manufacturing man-hours and manufacturing cost. Moreover, the distance between the edge of a ground plane 6 and its connecting point connected to a conductor via 7 nearest to the edge of the ground plane 6 can be made nearly zero, so that a high-frequency package can be prevented from deteriorating in transmission characteristics of high-frequency signal due to circuitry structure of stub.
|
