| 摘要 |
PURPOSE: A CMP(chemical mechanical polishing) apparatus and driving method thereof are provided to improve a throughput and a reliability by effectively cleaning a conditioning disc. CONSTITUTION: An apparatus comprises a polishing table(32) having a polishing pad(34), a supply unit(36) for supplying a polish solution to the polishing pad, a polishing head(38) for polishing a wafer(W), a conditioner(40) for conditioning the polishing pad(34), and a conditioner parking bath(44) formed one side of the polishing table and for standby the conditioner(40). The conditioner parking bath(44) further includes a deionized water supply tube(46), a chemical supply tube(48), and a brush(54) formed on the bottom of the conditioner parking bath(44).
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