发明名称 |
SEGMENT FOR PREVENTING UNDERCUT |
摘要 |
PURPOSE: A segment for preventing an undercut to reduce a production cost as improving a performance of a saw blade as increasing a tenacity. CONSTITUTION: Diamond particle is distributed as one layer only on a surface without containing the diamond particle in a segment. The diamond segment is produced by baking by mixing/forming metal powder with the diamond particle(15). A tenacity of the segment is decreased and the segment becomes brittle to be broken easily as the containment of the diamond increases because the diamond powder performs as a hetero-material. According to the fact, filling in the segment with the metal powder layer(16) is to increase the tenacity and distributing the surface with the diamond particle(15) is to prevent a breakage or exclusion of the segment for preventing undercut by shock. And also not using diamond in the segment reduces a cost.
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申请公布号 |
KR20000018648(A) |
申请公布日期 |
2000.04.06 |
申请号 |
KR19980036322 |
申请日期 |
1998.09.03 |
申请人 |
EHWA DIAMOND IND. CO., LTD.;GENERAL TOOL INCORPORATED |
发明人 |
KIM, SOO KWANG;YUN, SO YOUNG |
分类号 |
E21B10/00;B28D1/14;(IPC1-7):E21B10/00 |
主分类号 |
E21B10/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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