发明名称 SEGMENT FOR PREVENTING UNDERCUT
摘要 PURPOSE: A segment for preventing an undercut to reduce a production cost as improving a performance of a saw blade as increasing a tenacity. CONSTITUTION: Diamond particle is distributed as one layer only on a surface without containing the diamond particle in a segment. The diamond segment is produced by baking by mixing/forming metal powder with the diamond particle(15). A tenacity of the segment is decreased and the segment becomes brittle to be broken easily as the containment of the diamond increases because the diamond powder performs as a hetero-material. According to the fact, filling in the segment with the metal powder layer(16) is to increase the tenacity and distributing the surface with the diamond particle(15) is to prevent a breakage or exclusion of the segment for preventing undercut by shock. And also not using diamond in the segment reduces a cost.
申请公布号 KR20000018648(A) 申请公布日期 2000.04.06
申请号 KR19980036322 申请日期 1998.09.03
申请人 EHWA DIAMOND IND. CO., LTD.;GENERAL TOOL INCORPORATED 发明人 KIM, SOO KWANG;YUN, SO YOUNG
分类号 E21B10/00;B28D1/14;(IPC1-7):E21B10/00 主分类号 E21B10/00
代理机构 代理人
主权项
地址