| 摘要 |
<p>The system has a carrier assembly with perforations for distributing downward pressure on the semiconductor wafer. The system has a polishing pad, a polishing arm, and a carrier assembly. The carrier assembly includes perforations, and a plug for plugging selected perforations comprising a pressure resistant portion, a bottom portion attached to the pressure resistant portion, and a leak resistant portion extending from the pressure resistant portion, dimensioned to fit snugly into the bottom portion.</p> |
