| 摘要 |
PROBLEM TO BE SOLVED: To shorten the testing time of a semiconductor integrated circuit by eliminating the need for moving a probe card on the surface of a wafer. SOLUTION: A control circuit 11 of a test-only chip 1 is supplied with electricity from an external unit 5, via a probe card 4 in a power input pad 15 and a grounding pad 16 and outputs test data to the test circuit 22 of a chip 2 to be tested via a bus interface 12 and a bus line 3. The control circuit 11 serially sends test results to the external unit 5 via a serial communication circuit 13, a communication pad 14 and a probe card 3. Accordingly, the test- only chip 1 is connected to the external unit 5 via three probing pins 41-43 of the probe cards 4, which reduces the number of the probing pins of the probe card 4 to an extremely low level as compared with the number of the pads of the chip 2 to be tested on a wafer 8.
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