BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A ball grid array package is provided to exactly discern direction of a package and position of a pin although packaged with a unit by forming a visually dividable display at an external regular position. CONSTITUTION: A ball grid array package comprises a semiconductor chip attached to a flexible circuit tape, an encapsulant for protecting the semiconductor chip, a ball grid array for electrical connection, and any display for determining direction of the ball grid array at a predetermined position which is externally exposed. The ball grid array is formed on one surface of the semiconductor chip with a unit.