SEMICONDUCTOR DEVICE, CONNECTION METHOD FOR SEMICONDUCTOR CHIP, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

A semiconductor device comprising a support member (20) on which a wiring pattern (22) including lands (24) are formed, a semiconductor chip (10) having electrode bumps (12) placed on the lands (24) and face-down-bonded to the support member (20) and resin (30) which is stuck between the chip (10) and the member (20) to be shrunk by curing and brings the lands (24) and bumps (12) into close contact with each other using a stress caused by the cure-shrinking, part of the stress being absorbed by at least an elastic deformation of the member (20).