| 摘要 |
A system for handling discs, particularly semiconductor wafers, is disclosed. Optical beams are employed to detect a wafer's edge, position, and size. A wafer hand assembly member (101) is slipped under a wafer (122) or between parallel stacked wafers, and one or more fingers (105) are rotated 90 DEG to a position perpendicular to the plane of the stiff hand assembly member. The hand assembly also has one or more posts (103) positioned perpendicular to the surface of the hand assembly. The finger(s) and post(s) constitute three upright projections with the wafer to be grasped there between. A translator solenoid (117), controls the lateral location of one finger or post toward the other stationary fingers or post(s) grasping the wafer with controlled traction force between the fixed posts and the moveable finger. The traction force is controlled by the amount of driving energy fed to the translator solenoid.
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