| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a low TCR and low resistance value by paste-printing a resistance paste contg. a Cu-Ni alloy powder on a recess formed into a ceramic base and baking it in a neutral atmosphere. SOLUTION: Resistance layers 3 are printed on both sides of a square substrate 1 by a thick film forming method such as screen printing, etc., using a resistance paste. Top face electrode layers 2 are printed on a pair of opposed end faces of the substrate 1 so as to contact the resistance layers 3 plane to plane by the same material as the resistance layers 3, the resistance layers 3 and top face electrode layers 2 are baked at once in a neutral or reductive atmosphere. U-shaped end face electrode layers 4 are formed on both ends of the substrate 1. The resistance paste uses a mixture of a Cu-Ni alloy powder with a glass powder and a vehicle in which the mixture is dispersed. A terminal electrode paste uses a high-conductivity material such as commercially available metal Cu or metal Ni, etc.</p> |
