| 摘要 |
A thermal platform for testing and/or conditioning components, having a sealed housing with internal cavity, a plurality of coolant distribution penetrations leading to the cavity, and a plurality of heater elements. A series of identical high pressure coolant lines evenly distribute coolant from a central supply manifold to respective penetrations, the latter forming an array within the bottom of the thermal platform housing. Uniform coolant distribution is further accomplished via nozzles located at the ends of the high pressure lines such that the coolant flowing out of the nozzles impinges directly on the bottom side of the platform top surface. Liquid/gaseous phase coolant is returned to the coolant supply via a series of low-pressure return ports. Precise temperature control of the platform is further maintained through the selective use of the heating elements which are located immediately adjacent to the top surface.
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