THERMALLY AND ELECTRICALLY IMPROVED PBGA PACKAGE

摘要

PURPOSE: A package is provided to have an improved EM shielding and a good thermal spreading efficiency. CONSTITUTION: The package comprises: a substrate (20) having a ground pad; a die (22)attached to he substrate; a heat spreader (32) having a first support member formed upward of the substrate and the die, wherein the first support member is connected with the ground pad; a signal transfer portion (26) electrically connected between the substrate and the die; an encapsulation material (30) piled between the substrate, the die, and the heat spreader; and a ball grid array formed on a surface of a bottom side of the substrate.