| 摘要 |
PURPOSE: A CMP(chemical mechanical polishing) apparatus is provided to improve a yield and a reliability by constantly pressing a polishing pad using an electromagnetic force. CONSTITUTION: An apparatus comprises a motor case(21) having a stator(22) and a rotator (23), a head case(24) fixed in the center of the rotator(23), an upper fixed magnet(25) and a lower variable magnet(25-1) formed in the head case, a lower magnet guide(26) variably fixed the lower variable magnet to the inner wall of the head case, an electromagnet stopper(27) formed between the upper fixed magnet(25) and the lower variable magnet(25-1), and a polishing head(1) fixed in the lower variable magnet.
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