COMPOSITE MATERIAL FOR CHIP IMPEDANCE

摘要

PURPOSE: A composite material used for a chip impedance is provided to achieve noise removing property in 500-1000 MHz bands by mixing a magnetic substance and a dielectric substance. CONSTITUTION: A composite material comprises a magnetic substance having a spinel structure and a dielectric substance. Ni-Zn ferrite or Ni-Zn-Cu ferrite is used as the magnetic substance having the spinel structure. The dielectric substance contained to the magnetic substance is used BaTiO3 of 40-50 wt% or Al2O3 of 50-60 wt%. That is, the composite material is mixed the BaTiO3 of 40-50 wt% or Al2O3 of 50-60 wt% with the Ni-Zn ferrite or Ni-Zn-Cu ferrite.