MOLDING DEVICE OF FLEX BALL GRID ARRAY SEMICONDUCTOR PACKAGE USING CARRIER FRAME

摘要

PURPOSE: A molding device of a flex ball grid array package using a carrier frame is provided to prevent skew of a semiconductor chip and eliminate a skid by fixing molding speed. CONSTITUTION: A molding device of a flex ball grid array package using a carrier frame comprises a metal molding having a runner, a gate, and a cavity to make molding material of high temperature and pressure flow and fill; and a carrier frame installed on an upper portion of a circuit tape to extend a space of the gate. In the carrier frame, a half etching region is formed on a portion corresponding to the runner and the gate of the metal molding.