| 摘要 |
<p>A semiconductor device including a semiconductor element (10) having a plurality of electrodes (12) arranged on one line (L) and being bonded face-down, a substrate (20) formed thereon with wiring patterns (22) each having a bonding portion (24) connected to an electrode (12) of the semiconductor element (10) and a land portion (26) connected electrically to a bonding portion (24), external electrodes (30) connected to land portions (26) after passing through the substrate (20), and a support consisting of bumps (11, 21) and provided between the element (10) and the substrate (20), the electrodes (12) and the bonding portions (24) connected to each other and the support consisting of bumps (11, 21) keeping the element (10) and the substrate (20) almost parallel to each other.</p> |
