SEMICONDUCTOR ELEMENT AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A manufacturing method of a semiconductor element is provided to improve an overlay margin between a bit line contact hole and a plug layer. CONSTITUTION: A manufacturing method of a semiconductor element comprises: a semiconductor substrate on which a plurality of word lines formed; a first insulation layer having a plug contact hole between the word lines on the substrate including the word lines; a plug layer formed in and on the plug contact hole as a unity; second insulation layer side walls on both sides of the plug layer on the first insulation layer; a third insulation layer having a bit line contact hole formed on a portion of the plug layer including the second insulation layer side walls on the entire surface; and a bit line formed on the bit line contact hole and the third insulation layer adjacent to the bit line contact hole.