发明名称 |
COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM |
摘要 |
<p>The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition. <IMAGE></p> |
申请公布号 |
EP0991082(A1) |
申请公布日期 |
2000.04.05 |
申请号 |
EP19990913681 |
申请日期 |
1999.04.16 |
申请人 |
TDK CORPORATION;NOF CORPORATION |
发明人 |
YAMADA, TOSHIAKI;HASEGAWA, HIROAKI;YASUKAWA, YOSHIYUKI;ENDOU, KENJI;YAMADA, MICHIHISA;MORIYA, YASUO;YAMADA, TOMIHO;ITO, TETSUYA |
分类号 |
H01B3/18;C08K3/00;H01B3/44;H05K1/02;H05K1/03;(IPC1-7):H01B3/12;C08L101/00;H01B3/00;C08L51/06 |
主分类号 |
H01B3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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