发明名称 |
Structure of chip on chip mounting preventing crosstalk noise |
摘要 |
The present invention is intended to solve a problem of crosstalk noise in a so-called system module, which occurs as a result of interference between signals running in each of respective wiring layers of a first semiconductor chip and a second semiconductor chip stacked surface to surface with a small gap, and invites malfunctioning of semiconductor devices. As shown in Fig.1, the semiconductor device comprises a first semiconductor chip 1 having a first electrode pad 2 and a first wiring layer 9 in the main surface, a second semiconductor chip 5 having a second electrode pad 6 located at a corresponding place and a second wiring layer 10 in the main surface facing to the first semiconductor chip, a bump 4 for electrically coupling first electrode pad 2 and second electrode pad 6 together, an insulation layer 8 disposed between the main surfaces of first semiconductor chip 1 and second semiconductor chip 5 facing to each other, and an electro-conductive layer 7 disposed between the main surfaces of first semiconductor chip and second semiconductor chip facing to each other. <IMAGE> |
申请公布号 |
EP0740343(A3) |
申请公布日期 |
2000.04.05 |
申请号 |
EP19960106001 |
申请日期 |
1996.04.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;MATSUSHITA ELECTRONICS CORPORATION |
发明人 |
YOSHIDA, TAKAYUKI;OTSUKA, TAKASHI;FUJIMOTO, HIROAKI;MIMURA, TADAAKI;YAMANE, ICHIRO;YAMASHITA, TAKIO;MATSUKI, TOSHIO;KASUGA, YOAHIAKI |
分类号 |
H01L21/56;H01L23/552;H01L25/065;H01L25/18 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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