Curable epoxy resin compositions and electronic components

摘要

A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula (R<1>SiO3/2)a(R<2>2SiO2/2)b(R<2>3SiO1/2)c( R<3>O1/2)d in which R<1> is an epoxy-functional monovalent organic group, R<2> is a monovalent hydrocarbon group, R<3> is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c≥0. Also, an electronic component coated with a product obtained by curing the aforesaid composition.