发明名称 MULTILAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND PROCESS
摘要 <p>A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.</p>
申请公布号 EP0989914(A1) 申请公布日期 2000.04.05
申请号 EP19990906923 申请日期 1999.02.08
申请人 MICROMETAL TECHNOLOGIES INC. 发明人 HOOVER, MERWIN, F.;BRADSHAW, JOHN, H.;BURKE, THOMAS, F.
分类号 B32B9/00;C23C14/02;C23C14/06;C23C14/20;D03D15/04;H05K3/38;(IPC1-7):H05K3/38;B32B7/00;B32B3/00;C23C14/30;B05D5/12;B32B15/08 主分类号 B32B9/00
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