发明名称 HEAT SPREADER SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS
摘要 <p>An atomizer (50) for atomizing a liquid coolant (40), is positioned inside a sealed housing (20). The atomized liquid coolant (40) is distributed as a thin film over the surface of the heat generating components (30) and the wall of the sealed housing (20). Heat is transferred from the surface of the heat generating components (30) by vaporization of at least a portion of the thin film liquid coolant (40). The coolant vapor condenses on the housing (20) and other cool surfaces and returns to the liquid state. The system heat is then removed from the outer surfaces of the housing (20) using conventional heat transfer mechanisms (22).</p>
申请公布号 EP0990378(A1) 申请公布日期 2000.04.05
申请号 EP19970927667 申请日期 1997.05.15
申请人 RAYTHEON E-SYSTEMS INC. 发明人 HAVEY, MORT, L.;HITCH, WILLIAM, ROBERT
分类号 H01L23/427;H01L25/10;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/427
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