APPARATUS FOR REMOVING POWDER OF SEMICONDUCTOR WAFER DEPOSIT EQUIPMENT

摘要

PURPOSE: An apparatus for removing powder of semiconductor wafer deposit equipment is provided to prevent an unexpectedly down by installing a powder collecting means on a sub-exhaust line and collecting a powder using the powder collecting means. CONSTITUTION: A reaction road(11) and a pump(12) are connected to a sub-exhaust line(13).A fore-line valve(14) and a throttle valve(15) are installed on the sub-exhaust line(13). The pump(12) and a main duct(16) are connected to a main exhaust line(17). A gas cleaner(18) is installed on the main exhaust line(17). A powder collecting means(20) for collecting a powder is installed on the sub-exhaust line(13) located between the throttle valve(15) and the valve(12). The powder collecting means(20) separates a certain portion of the sub-exhaust line(13) and has a collecting box(22), a circular separating plate(23), and a step motor(24).