发明名称 CARRYING METHOD OF LARGE SIZE WAFER
摘要 PURPOSE: A large size wafer carrying method is provided to prevent damage of a large size wafer during a transporting by dividing the large size wafer by two or four. CONSTITUTION: A large size wafer carrying method comprises the steps of equally dividing a large-sized wafer into many parts, containing the divided wafer parts in a wafer carrier fabricated according to a size of the divided wafer part, and carrying the divided wafer parts to a packaging process line. The wafer is divided by a diamond wheel or a scribe and break method.
申请公布号 KR20000018920(A) 申请公布日期 2000.04.06
申请号 KR19980036771 申请日期 1998.09.07
申请人 KOREA ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 LEE, YEONG MIN;LEE, SANG BOK;JOO, CHEOL WON;PARK, SEONG SU
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址