发明名称 |
CARRYING METHOD OF LARGE SIZE WAFER |
摘要 |
PURPOSE: A large size wafer carrying method is provided to prevent damage of a large size wafer during a transporting by dividing the large size wafer by two or four. CONSTITUTION: A large size wafer carrying method comprises the steps of equally dividing a large-sized wafer into many parts, containing the divided wafer parts in a wafer carrier fabricated according to a size of the divided wafer part, and carrying the divided wafer parts to a packaging process line. The wafer is divided by a diamond wheel or a scribe and break method.
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申请公布号 |
KR20000018920(A) |
申请公布日期 |
2000.04.06 |
申请号 |
KR19980036771 |
申请日期 |
1998.09.07 |
申请人 |
KOREA ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
LEE, YEONG MIN;LEE, SANG BOK;JOO, CHEOL WON;PARK, SEONG SU |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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