发明名称 DEFLECTION REMOVING DEVICE AND DEFLECTION REMOVING METHOD OF CUTTING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a deflection removing device of cutting tool to remove the deflection of the cutting tool of a cutting device which cuts a work by bringing the cutting tool rotating being installed to a rotary shaft into contact with the work, and to realize the rotation of the cutting tool without generating a deflection securely constantly. SOLUTION: This deflection removing device of cutting tool is provided with a grinding wheel 12 fixed to the work table 51 of a cutting device, and moving integrally; a deflection amount detecting sensor 13 to detect the deflection amount of a cutting tool 54; and a contact detecting sensor to detect the abutting of the cutting tool 64 and the grinding wheel 12. In this case, the deflection amount is detected by the deflection amount detecting sensor 13 by rotating the cutting tool 64 installed to a rotary shaft, and the grinding wheel 12 is advanced to the cutting tool side by moving the work table 51. After the cutting tool 64 and the grinding wheel 12 are contacted, the grinding wheel 12 is advanced to the cutting tool 64 side further, as the deflection amount part, so as to grind off the deflection part of the cutting tool 64.
申请公布号 JP2000094247(A) 申请公布日期 2000.04.04
申请号 JP19980287297 申请日期 1998.09.24
申请人 SEIKO SEIKI CO LTD 发明人 KUWABARA OKIKAZU
分类号 B23Q17/00;B23Q1/00;B23Q1/76;(IPC1-7):B23Q1/76 主分类号 B23Q17/00
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