| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate placing stand capable of more uniformly heating the surface of a substrate by a small heater. SOLUTION: This is a substrate placing stand in a device provided with a heater, placed with a suscepter 2 on the heater 1 and heating a substrate 3 via the suscepter, and the material composing the outer circumferential part 2a of the suscepter 2 is the one whose thermal conductivity is higher than that of the material composing the center part 2b. By this composition, larger capacity of heat is tranferred to the outer circumferential part of the substrate 3, the heat transfer quantity per unit area between the center part 2b and outer circumferential part 2a in the heater 1 is balanced, and the substrate 3 can uniformly be heated even if the diameter of the heater 1 is small.
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