MAGNETRON SPUTTERING SYSTEM AND FILM FORMING METHOD USING THE SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a magnetron sputtering system capable of obtaining a satisfactory film by efficiently shielding the to be applied with a film in which the componental ratios are not desirable or components disadvantageous for a substrate at a place far from an erosion region in a device for film-forming a compd. or an oxide in particular. SOLUTION: Plural planar shielding plates 7 vertical to a sputtering target 3 are arranged at the intervals narrower than the unit width of a magnetic circuit in the space between the sputtering target 3 and a substrate 4 confronted with the target 3. This system has plural magnetic circuits. In the movable system, plural fixed shielding plates are arranged within the operating range to be coped with the movable type. Also lattice-shaped or honeycomb-shaped shielding plates are arranged according to circumstances.