| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a prepreg which solves problems in prior art, has good flexibility at room temperature, is free from resin stripping, and excellent in heat resistance and electrical insulation property after press-molding, a multilayer printed-wiring board using the prepreg having the excellent properties, and a method for manufacturing the multilayer printed-wiring board. SOLUTION: This prepreg comprises a mixture of a polycarbodiimide resin and an epoxy resin and is in a form of a film, or comprises a mixture of a polycarbodiimide resin and an epoxy resin and a base material. In a multilayer printed-wiring board where an inner layer base plate and an insulating adhesive layer is alternately laminated and glued, the multilayer printed-wiring board uses the prepreg as the insulating adhesive layer. Further, in a manufacturing method for the multilayer printed-wiring board, the necessary part between the inner layer base plates is conducted, after the inner layer base plate and the prepreg are alternately laminated and glued.</p> |
