发明名称 HOUSING EQUIPMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide the housing equipment eliminating the need for the frequent replacements of reticules at the given device side, including an exposurer and capable of enhancing processing efficiency. SOLUTION: On sending glass substrates to the housing equipment 18 from processing device groups 11-16 side, the glass substrates are housed in housing bodies associated with layers. On housing 20 substrates in each housing body, the glass substrates for every layer are continuously sent to an exposurer 20 side. The exposure-treated glass substrates in the exposurer 20 are successively housed in each original first housing body. The glass substrates are returned to the processing device groups 11-16 side, to send the glass substrates to the housing equipment 18 from the processing device groups 11-16 side. Such the housing operation and returning operation are alternately interchanged between the first and a second housing body.</p>
申请公布号 JP2000094233(A) 申请公布日期 2000.04.04
申请号 JP19980288678 申请日期 1998.09.28
申请人 TOKYO ELECTRON LTD 发明人 IWAZU HARUO
分类号 B23P19/00;G03F7/20;H01L21/027;H01L21/673;H01L21/68;(IPC1-7):B23P19/00 主分类号 B23P19/00
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