发明名称 MACHINING METHOD FOR SURFACE
摘要 PROBLEM TO BE SOLVED: To improve circulation of grinding water to increase cooling efficiency by using a grind stone not allowing contact between a surface of a machined object and all the slant face for forming crest parts and root parts in time of grinding. SOLUTION: A solar battery wafer W is cut in by a prescribed depth so that a large number of root parts 32 corresponding to shapes of crest parts 35 of a grind stone 16 are formed on a surface of the solar battery wafer W (a first grinding process). At this stage, only the root parts 32 are formed, while portions except the root parts remains as flat surfaces 41. Besides, each distance between bottom points 34 of the adjacent root parts 32 is two pitches. Then, after a grinding means is evacuated once upward to be moved to a Y+ direction by one pitch, the solar battery wafer W is newly cut by the same depth as in the first grinding process with grinding water supplied, so that new root parts 32 are formed on the flat surfaces 41 lying midway between the respective root parts 32, 32 formed in the first grinding process. As a result, crest parts 31 are formed between the respective root parts 32, 32.
申请公布号 JP2000094290(A) 申请公布日期 2000.04.04
申请号 JP19980269427 申请日期 1998.09.24
申请人 DISCO ABRASIVE SYST LTD 发明人 KAJIYAMA KEIICHI;SEKIYA KAZUMA
分类号 B24B13/00;B24B13/01;B24B19/02;H01L21/304;(IPC1-7):B24B19/02 主分类号 B24B13/00
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