| 发明名称 |
Plastic molded semiconductor package and method of manufacturing the same |
| 摘要 |
A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.
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| 申请公布号 |
US6046071(A) |
申请公布日期 |
2000.04.04 |
| 申请号 |
US19970976603 |
申请日期 |
1997.11.24 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
SAWAI, AKIYOSHI;SHIMAMOTO, HARUO;TACHIKAWA, TORU;SHIBATA, JUN |
| 分类号 |
H01L21/56;H01L21/58;H01L21/60;H01L21/68;H01L23/12;H01L23/28;H01L23/31;H01L23/367;H01L23/485;H01L23/498;H05K3/30;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/56 |
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