Process for producing very thin semiconductor chips

摘要

The novel process facilitates the production of very thin semiconductor chips with thicknesses down to a few mu m. The semiconductor chip is first of all arranged on contact surfaces, with the active side oriented toward the contact surfaces. The chip is then electrically connected to the contact surfaces via contact studs. Silicon is then removed from the exposed rear side of the semiconductor chip during a plasma etching process which has high selectivity with respect to the other materials.