| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and a method thereof capable of easily controlling a guide ring for holding an object of polishing. SOLUTION: In a polishing device which has a turntable 24 with a polishing surface, a top ring body 3, and a guide ring 5 for holding a semiconductor-wafer 6 around the top ring body 3, and which polishes the semiconductor-wafer 6 by interposing the semiconductor-wafer 6 between the turntable 24 and the top ring body 3 and pressing it by a specified pressure, the guide ring 5 is provided so that it can be moved vertically with respect to the top ring body 3, and means 3-3, 27 for fixing and detaching the guide ring 5 to and from the top ring body 3 are provided. |
